Sun Chemical Debuts Solvent-Free ULM Adhesive for Flexible Packaging

Sun Chemical launched a new SunLam solvent-free ultra-low monomer (ULM) adhesive, designed for packaging producers searching for high-performance applications that offer a sustainable alternative to existing solvent-based adhesives.

Officially titled SunLam QA-8000+HA450, the new adhesive is part of Sun Chemical’s proprietary ULM technology. The adhesive extends its capabilities to meet the needs of flexible packaging manufacturers producing high-end applications such as extended boiling-pasteurisation, hot-filling, low-retort packaging, and products that require improved chemical resistance in acidic or alcoholic environments.

SunLam QA-8000+HA450 has been fully tested in combination with Sun Chemical’s full polyurethane (PU) solvent-based inks technology and also works seamlessly with Sun Chemical’s Aqualam water-based inks to ensure compatibility for retort applications.

Nicolas Bétin, Director of Product Strategy EMEA, Packaging Inks & Materials, commented, “We’re delighted to launch SunLam QA-8000+HA450, which offers packaging producers an energy-efficient alternative that delivers the performance required for high-end packaging. This product underscores our commitment to providing customers with a portfolio that balances efficiency and safety with sustainability demands.  At Sun Chemical, we are proud to offer a range of full PU and non-solvent technologies for adhesive and ink solutions.”

Key features include:

• Helps reduce energy consumption and CO₂ emissions: its VOC-free formulation has no drying requirements on a laminator.
• Supports lightweighting and facilitates mechanical recyclability for mono-material packaging thanks to a lower coating weight compared to solvent-based technology.
• Offers easy processability and fast bond strength development
• Features excellent thermal resistance and lay-down on printed substrates